January 11, 2024
(press release)
–
Packaging Innovations & Empack, along with Contract Pack & Fulfilment, is the UK’s leading event promoting innovation and business in the primary and secondary packaging industry. On February 21 and 22, 2024, the Taghleef Industries team will be present at Stand S22 at the NEC, Birmingham, to showcase its wide range of innovative flexible packaging, labeling and laminating films for various applications as part of Dynamic Cycle™ solutions. Also, during this edition, Monica Battistella, Sustainability Manager at Ti will be one of the speakers speaking on Thursday, February 22 at 10:30 AM to discuss “Packaging for the future: Why design for recycling is key”. The reDESIGN™ of traditional multilayer structures with innovative flexible packaging solutions is an important step toward developing more sustainable and recyclable packaging options. This session will explore how it is possible to make the right choices when it comes to packaging design to ensure that it is suitable to be collected, sorted, and recycled and that it flows back into economy. Starting from an overview of the world of plastics and moving to the main global challenges that we are all facing today. Meet the Ti Team to discuss how to reDESIGN™ traditional structures and make them more recyclable, sustainable and in line with Circular Economy principles.
* All content is copyrighted by Industry Intelligence, or the original respective author or source. You may not recirculate, redistrubte or publish the analysis and presentation included in the service without Industry Intelligence's prior written consent. Please review our terms of use.
