A comprehensive view of Multilayer / Laminate Materials. This page highlights a small sample of our full coverage.
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Recent Articles

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Taiwan Semiconductor Mfg Submits Patent Application for Bilayer Seal Material for Air Gaps in Semiconductor Devices

Toyobo Co Ltd Files Patent Application for Laminated Film and Packaging Material

Patent Issued for Horizontally oriented liquid crystal cured film and laminate including the same (USPTO 11971566)

U.S. Patent and Trademark Office Publishes Hyundai Motor Company and Kia Corp's Patent Application for Laminated Composite with Non-Uniform Profile and Method of Manufacturing the Same

INTERNATIONAL PATENT: TORAY ADVANCED MATERIALS KOREA INC., 도레이첨단소재 주식회사 FILES APPLICATION FOR "HARD-COATING COMPOSITION FOR DECORATIVE SHEET AND DECORATIVE SHEET PREPARED THEREFROM"

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