CHIPS for America investing at least US$200M to create a digital twin institute for semiconductor and advanced packaging manufacturing; also, Dept. of Commerce to award approximately US$300M in funding for multiple R&D projects in substrates, materials

Sample article from our Housing & Economy

January 31, 2024 (press release) –

President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022—creating a $52 billion investment to revitalize America’s domestic semiconductor industry and strengthen the country’s economic and national security. Of that sum, CHIPS for America within the U.S. Department of Commerce is responsible for administering $11 billion to advance U.S. leadership in semiconductor R&D through four programs: 

  • The National Semiconductor Technology Center   
  • The National Advanced Packaging Manufacturing Program    
  • The CHIPS Metrology Program   
  • The CHIPS Manufacturing USA Institute  

CHIPS for America has released the following Notices of Intent (NOI) for future funding opportunities for CHIPS R&D Programs: 

January 31, 2024: Notice of Intent: CHIPS Manufacturing USA Institute

CHIPS for America is investing at least $200 million in a CHIPS Manufacturing USA Institute to create the first-of-its-kind digital twin institute to lead the world in revolutionizing semiconductor and advanced packaging manufacturing.   

CHIPS for America’s Eric Forsythe, Director of the CHIPS Manufacturing USA Institute, will provide a briefing about the program’s vision, strategy, and next steps on February 2, 2024, at 3:00 pm ET. Webinar participants must register in advance. 

CHIPS for America will host a virtual Industry Day on February 12, 2024, at 12:30 pm ET. Learn more and register here

January 31, 2024: Notice of Intent: National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development

The Department of Commerce issued a Notice of Intent to announce a competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for packaging semiconductors.  

The CHIPS for America program anticipates awarding approximately $300 million in funding for multiple projects in substrates and substrate materials research. 

The NAPMP will invest a total $3 billion in programs that include an advanced packaging piloting facility for validating and transitioning new technologies to U.S. manufacturers, workforce training programs to ensure that new processes and tools are capably staffed, and funding for projects. 

Resources

 

* All content is copyrighted by Industry Intelligence, or the original respective author or source. You may not recirculate, redistrubte or publish the analysis and presentation included in the service without Industry Intelligence's prior written consent. Please review our terms of use.

See our dashboard in action - schedule an demo
Chelsey Quick
Chelsey Quick
- VP Client Success -

We offer built-to-order housing & economy coverage for our clients. Contact us for a free consultation.

About Us

We deliver market news & information relevant to your business.

We monitor all your market drivers.

We aggregate, curate, filter and map your specific needs.

We deliver the right information to the right person at the right time.

Our Contacts

1990 S Bundy Dr. Suite #380,
Los Angeles, CA 90025

+1 (310) 553 0008

About Cookies On This Site

We collect data, including through use of cookies and similar technology ("cookies") that enchance the online experience. By clicking "I agree", you agree to our cookies, agree to bound by our Terms of Use, and acknowledge our Privacy Policy. For more information on our data practices and how to exercise your privacy rights, please see our Privacy Policy.