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US Patent Issued to Taiwan Semiconductor Manufacturing on April 23 for "Localized heating in laser annealing process" (Belgian, American Inventors)
Published: April 24, 2024 by U.S. Fed News
US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 23 for "Method for forming package structure with cavity substrate" (Taiwanese Inventors)
Published: April 24, 2024 by U.S. Fed News
US Patent Issued to ADVANCED MICRO DEVICES on April 23 for "Methods and apparatus for synchronizing data transfers across clock domains using heads-up indications" (Colorado, Texas Inventors)
Published: April 24, 2024 by U.S. Fed News
US Patent Issued to Sumitomo Chemical on April 23 for "Nitride semiconductor substrate, laminate, substrate selection program, substrate data output program, off-angle coordinate map, and methods thereof" (Japanese Inventors)
Published: April 24, 2024 by U.S. Fed News
Intel stock price forecast: death cross nears ahead of earnings
Published: April 24, 2024 by Invezz

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