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Recent Articles

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TOYO SEIKAN CO., LTD. files international patent application for "MOLDING CONDITION DERIVATION DEVICE, MACHINE LEARNING DEVICE, INFERENCE DEVICE, INFORMATION PROCESSING METHOD, MACHINE LEARNING METHOD...

Goglio wins 'Service Provider Award' at Panda d'Oro Gala; expands Latin American market reach with Feria Alimentec 2024 participation

Bobst Group celebrates Kemna Druck's 50th anniversary; showcases digital printing solutions and future of print technology at Bielefeld Packaging Center

Amcor promotes sustainability and innovation in packaging through stakeholder engagement and presence at FISPAL+TECNOCARNE 2024; showcases latest technologies and fosters collaborations for sustainable solutions.

DS Smith Packaging France to install Highcon Beam 3 digital die cutting system; project supports growing demand for sustainable packaging solutions, says DS Smith managing director

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