CHIPS for America investing at least US$200M to create a digital twin institute for semiconductor and advanced packaging manufacturing; also, Dept. of Commerce to award approximately US$300M in funding for multiple R&D projects in substrates, materials

Sample article from our R&D/Patents

January 31, 2024 (press release) –

President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022—creating a $52 billion investment to revitalize America’s domestic semiconductor industry and strengthen the country’s economic and national security. Of that sum, CHIPS for America within the U.S. Department of Commerce is responsible for administering $11 billion to advance U.S. leadership in semiconductor R&D through four programs: 

  • The National Semiconductor Technology Center   
  • The National Advanced Packaging Manufacturing Program    
  • The CHIPS Metrology Program   
  • The CHIPS Manufacturing USA Institute  

CHIPS for America has released the following Notices of Intent (NOI) for future funding opportunities for CHIPS R&D Programs: 

January 31, 2024: Notice of Intent: CHIPS Manufacturing USA Institute

CHIPS for America is investing at least $200 million in a CHIPS Manufacturing USA Institute to create the first-of-its-kind digital twin institute to lead the world in revolutionizing semiconductor and advanced packaging manufacturing.   

CHIPS for America’s Eric Forsythe, Director of the CHIPS Manufacturing USA Institute, will provide a briefing about the program’s vision, strategy, and next steps on February 2, 2024, at 3:00 pm ET. Webinar participants must register in advance. 

CHIPS for America will host a virtual Industry Day on February 12, 2024, at 12:30 pm ET. Learn more and register here

January 31, 2024: Notice of Intent: National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development

The Department of Commerce issued a Notice of Intent to announce a competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for packaging semiconductors.  

The CHIPS for America program anticipates awarding approximately $300 million in funding for multiple projects in substrates and substrate materials research. 

The NAPMP will invest a total $3 billion in programs that include an advanced packaging piloting facility for validating and transitioning new technologies to U.S. manufacturers, workforce training programs to ensure that new processes and tools are capably staffed, and funding for projects. 



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