US patent issued to IP for 'anti-microbial paper substrates useful in wallboard tape applications'

ALEXANDRIA, Virginia , December 24, 2013 () – US Patent Issued to International Paper on Dec. 24 for "Anti-microbial paper substrates useful in wallboard tape applications" (Ohio, Tennessee Inventors)

ALEXANDRIA, Va., Dec. 24 -- United States Patent no. 8,613,829, issued on Dec. 24, was assigned to International Paper Co. (Memphis, Tenn.).

"Anti-microbial paper substrates useful in wallboard tape applications" was invented by Dennis W. Anderson (Goshen, Ohio), Bianca A. Morganroth (Cincinnati) and William A. Payne (Cordova, Tenn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This invention relates to paper products and/or substrates suitable for being made into wallboard tape (also may be known as joint tape and/or drywall tape) and having improved reduction or inhibition in the growth of microbes, mold and/or fungus. The paper substrate is characterized by its excellent physical properties including cross direction (CD) tensile, machine (MD) tensile, internal bond, wet tensile, hygroexpansivity, curl, bonding properties, bonding of joint tape to joint compound, etc. The paper product of the invention contains a sizing agent and an antimicrobial compound as well as other optional components including without limitation a binder. The paper product of the invention may be produced by contacting the plurality of cellulose fibers with each of the sizing agent, antimicrobial compound, and optional components at any point in the papermaking process, converting process, and/or post-converting process. Finally, the invention relates to methods of using the paper substrate."

The patent was filed on July 9, 2010, under Application No. 12/833,344.

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