April 27, 2023
(press release)
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Join us at Flexo & Labels Summit on May 22-24, 2023, Booth #12 at the Rebouças Convention Center, São Paulo, Brazil Single component UV curing or solvent free thermal curing system. Elkem Silicones is able to offer these and other options to promote the non-adherence of labels, ribbons and other graphic products. We will also be introducing our latest product - SILCOLEASE™ UV POLY 125. Together with SILCOLEASE™ UV POLYS 120 and 123, this new polymer completes the complete complement of release resistance products. SILCOLEASE™ UV POLY 125 offers mid range release level (10-15g/in), can be pattern coated as well as work with a variety of pressure sensitive adhesives including peel-offs. We will present all these solutions at our stand during the event. Come and meet our team, we will be waiting at booth #12!
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