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Recycling leaders at Sustainability in Packaging US conference advocate for early collaboration between packaging designers and MRF operators so as not to waste time or money; recyclers also highlight use of AI for helping with sorting and waste analytics
Published: March 18, 2025 by Waste Dive
World Intellectual Property Organization Releases Qualcomm Incorporated Patent Application for Apparatus and Method for Configuring a Interconnect Link Between Chiplets
Published: March 18, 2025 by Broadband and Wireless Network News
INTERNATIONAL PATENT: THE BOSTON CONSULTING GROUP, INC. FILES APPLICATION FOR "SYSTEMS AND TECHNIQUES FOR OPTIMIZING THE IMPLEMENTATION AND OPERATION OF POWER-TO-X PLANTS"
Published: March 18, 2025 by U.S. Fed News
INTERNATIONAL PATENT: NOVELIS INC. FILES APPLICATION FOR "COLD ROLLING MILL WITH DYNAMIC TARGET SHAPE CONTROL"
Published: March 18, 2025 by U.S. Fed News
Patent Issued for Etching method (USPTO 12237174)
Published: March 18, 2025 by Daily Asia Business

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