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Recent Articles

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Taiwan Semiconductor Mfg Files United States Patent Application for Vacancy-Rich Silicon for Use with a Gallium Nitride Epitaxial Layer
Published: May 09, 2024 by Semiconductor Patent News
Regeneron Pharma Submits United States Patent Application for Water Loss from Silicone Tubing and Effect on Protein Concentration During Drug Product Manufacturing
Published: May 09, 2024 by Biotechnology Patent News
HPQ Silicon enters agreement with Impact Funding Europe for advance HPQ’s projects for green engineering of silica and silicon-based materials
Published: May 08, 2024 by GlobeNewswire
INTERNATIONAL PATENT: DOW SILICONES CORPORATION FILES APPLICATION FOR "SILICONE COATING COMPOSITION WITH MICA"
Published: May 08, 2024 by U.S. Fed News
US Patent Issued to Taiwan Semiconductor Manufacturing on May 7 for "Method to form memory cells separated by a void-free dielectric structure" (Taiwanese Inventors)
Published: May 08, 2024 by U.S. Fed News

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