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Qualcomm Inc Files Patent Application for a Repeater-Based Architecture for Intelligent Reflective Surface Deployment

Qualcomm Inc Files Patent Application for Stacked Die Integrated Circuit Package Employing Interposer for Coupling an Upper Stacked Die(S) to a Package Substrate for Package Height Reduction, and Related Fabrication Methods

Qualcomm Inc Files Patent Application for Digital Beamforming Based on Unique Pre-Discrete Fourier Transform Spreading Sequences

Qualcomm Inc Files Patent Application for Controlling Repeated Requests from a User Equipment for Positioning Assistance in a Wireless Network

Qualcomm Inc Files Patent Application for Indication of Sub-Physical Resource Block with Frequency Domain Resource Allocation Field

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