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Qualcomm Inc files patent application for uplink ACK/NACK and SR in short durations; inventors include Wang Renqiu, Huang Yi, Park Seyong, Gaal Peter, and Chen Wanshi, filed on Jan 20, 2024.

Meiyume executive discusses smart beauty packaging, says digital native Gen Z consumers will expect more in terms of product information, transparency; Gen Z also driving trends in ‘visually powerful’ designs that are also ‘sustainable in essence’

Intel Corp. is assigned US Patent No. 12,007,807 on June 11 for "Hinge configuration for an electronic device"; invention by James M. Okuley and Kimi Jensen from Oregon.

Patent issued for positioning measurement reporting by QUALCOMM Incorporated; patent number 11991113, filed on May 12, 2021, and published online on May 21, 2024.

UK Patent Office publishes Zebra Tech's patent application for mobile dimensioning method and apparatus; application number is GB20220004914, publication number is GB2602604.

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