A comprehensive view of Packaging Use. This page highlights a small sample of our full coverage.
For real-time access, please log in to your R&D/Patents Market Intelligence Service.

Recent Articles

sample of recent headlines, press releases and get more..

Shandong Jin Tian He Paper mill in China selects Valmet to deliver HT-BCTMP line equipment; Valmet's high-temperature pretreatment technology will enable energy-efficient production of high bulk pulp for board machine, producing food packaging paperboard

TerraSafe Materials announces license agreement with North Carolina State University for technologies with potential to advance biodegradable coatings and polymer alternatives for packaging; license includes multiple patent applications for biomaterials

Henkel announces certification of its adhesive solution Aquence PS 3017 RE as recyclable as a packaging component; adhesive is designed for the olefinic filmic labels used for wash-off PET bottles

LEIPA launches digitally printable board, available across its board portfolio, including two types of grey board, brown natron board, graphic solid board in white tones; customers can print images, barcodes, numbers directly onto LEIPA's board sheets

Every 1% increase in consumer goods companies' plastic production is linked to 1% rise in plastic pollution, finds international collaborative study; top contributors to branded plastic waste reportedly include The Coca-Cola Co., PepsiCo, Nestle, Danone

Ask us about our R&D/Patents market view

Trending Chart

Interactive chart with headline count