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Japan - Patent Issued for Nitride semiconductor multilayer structure, light emitting element, light source apparatus, and method for producing nitride semiconductor multilayer structure (USPTO 11444434)
Published: September 28, 2022 by Daily Asia Business
At FachPack 2022 in Germany, Jindal to highlight various print, barrier and sealing technologies designed to facilitate the switch from non-recyclable laminates toward monomaterial mechanically recyclable PP based laminates for flexible packaging markets
Published: September 27, 2022 by Jindal Poly Films
Jindal to highlight new generation of its high barrier Ethy-Lyte films at FachPack trade show in Germany; 25HD800 is a 25µm transparent BOPE printing film with one side coated in EVOH, 25HDM285 is a 25µm BOPE lamination film with one side metallized
Published: September 27, 2022 by Jindal Poly Films
Global solvent-based plastic recycling market to reach US$965.1M by 2030, after growing at 5.9% CAGR; solvent processes are best suited for multilayer plastic materials used in medical, food packaging, electronics, for removing impurities from PET, PE
Published: September 27, 2022 by Globe Newswire
Dow Global Technologies receives US patent for compositions, multilayer films for reclosable packaging; composition may include ethylene/a-olefin copolymer, styrenic block copolymer, and film may include at least three layers: Patent No. 11,434,354
Published: September 23, 2022 by Chemicals & Chemistry Business Daily

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