A comprehensive view of Multilayer/Laminate Materials. This page highlights a small sample of our full coverage.
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Japan - Patent Issued for Nitride semiconductor multilayer structure, light emitting element, light source apparatus, and method for producing nitride semiconductor multilayer structure (USPTO 11444434)

At FachPack 2022 in Germany, Jindal to highlight various print, barrier and sealing technologies designed to facilitate the switch from non-recyclable laminates toward monomaterial mechanically recyclable PP based laminates for flexible packaging markets

Jindal to highlight new generation of its high barrier Ethy-Lyte films at FachPack trade show in Germany; 25HD800 is a 25µm transparent BOPE printing film with one side coated in EVOH, 25HDM285 is a 25µm BOPE lamination film with one side metallized

Global solvent-based plastic recycling market to reach US$965.1M by 2030, after growing at 5.9% CAGR; solvent processes are best suited for multilayer plastic materials used in medical, food packaging, electronics, for removing impurities from PET, PE

Dow Global Technologies receives US patent for compositions, multilayer films for reclosable packaging; composition may include ethylene/a-olefin copolymer, styrenic block copolymer, and film may include at least three layers: Patent No. 11,434,354

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