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Recent Articles

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State Intellectual Property Office of China Releases Bostik Inc's Patent Application for Low Tack Hot-Melt Pressure Sensitive Adhesives

Henkel Seeks Patent for Dimensionally Stable, Wipe-on, Modified-Polyether-Polyurethane-Based Adhesive Compound

Shin-Etsu Chemical Files United States Patent Application for Adhesive Composition for Flexible Printed-Wiring Board (FPC) and Heat-Curable Resin Film, Prepreg and FPC Substrate Containing Same

3M Innovative Properties Seeks Patent for Pressure Sensitive Adhesive Having Broad Compatibility with Non-Halogenated Flame Retardants

WIPO publishes Selig Sealing Products' international patent filing for compostable sealing member; invention does not contain plastic, metal foil layers, can be used for ultrasonic sealing, conduction heating, adhesives: Publication No. WO/2022/197903

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