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US Patent Issued to Intel on Dec. 6 for "Schottky diode structures and integration with III-V transistors" (Oregon Inventors)

US Patent Issued to Intel on Dec. 6 for "Gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs" (Oregon Inventors)

US Patent Issued to Intel on Dec. 6 for "Deep in memory architecture using resistive switches" (Oregon, California Inventors)

US Patent Issued to Intel on Dec. 6 for "Stiffener for die crack prevention in semiconductor packages" (Malaysian Inventors)

US Patent Issued to Intel on Dec. 6 for "Composite bridge die-to-die interconnects for integrated-circuit packages" (Malaysian Inventors)

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