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STI Group folding box experts to showcase smart packaging solutions that integrate digital product information--including VR, AR and the Digital Product Passport--at Touchpoint Packaging stage at Drupa; dynamic codes allow for easy updates, customization

drupa cube will offer more than 50 sessions where thought leaders discuss megatrends in international business, future of printing, packaging industry, innovations in smart packaging, strategies for circular economy at drupa 2024, May 28-June 7

Taiwan International Tradeshows: Qualcomm will be delivering a keynote speech at COMPUTEX 2024, sharing insights on 'The PC Reborn' showcasing where innovation creates disruption in a mature industry

Patent Application Titled 'Systems And Methods For Efficiently Establishing Peer-To-Peer Connections' Published Online (USPTO 20240137996)

LG CEO makes strategic visit to US, with goals to attract investors and talents amid new opportunities in AI, cloud, big data; maker of smart electronics aims to accelerate AI integration into all of its businesses to 'revolutionize customer experience'

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