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United States Patent for Injection Molding System Issued to Seiko Epson

US Patent Issued to Canon Virginia, Canon U.S.A. on July 23 for "Injection molding system with conveyors to insert or eject molds" (Japanese Inventors)

US Patent Issued to Seiko Epson on July 23 for "Plasticizing device, three-dimensional shaping device, and injection molding device" (Japanese Inventor)

US Patent Issued to SEIKO EPSON on July 23 for "Injection molding system" (Japanese Inventors)

Patent Issued for Display device for injection molding machine (USPTO 12023833)

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