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Arkema reports full-year 2023 sales down 16.1% year-over-year to €9.5B amid volumes down 10.0%

ARKEMA to showcase portfolio of materials for composites at JEC event; company to highlight sustainable solutions, including smart adhesives, lower-VOC Sartomer reactive diluents and more

US Patent Issued to Bostik on Feb. 27 for "Hot melt adhesive containing a hydrogenated styrenic block copolymer and an ethylene vinyl acetate copolymer exhibiting low blocking force" (Wisconsin Inventors)

US Patent Issued to ARKEMA FRANCE on Feb. 27 for "Use of a copolyamide composition as a matrix of filler material with glass fibres having a circular cross section for limiting warping" (French Inventors)

US Patent Issued to BOSTIK on Feb. 27 for "Multilayer film for resealable packaging with improved resealing" (French Inventors)

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