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Recent Articles

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Microminiature chip achieves record processing speeds; device competes for 'Coolest Thing Made in California' title
Published: September 11, 2024 by Industry Intelligence Inc.
US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 10 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)
Published: September 11, 2024 by U.S. Fed News
US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 10 for "Nanosheet device architecture for cell-height scaling" (Taiwanese Inventors)
Published: September 11, 2024 by U.S. Fed News
US Patent Issued to TOYO SEIKAN GROUP HOLDINGS, TOYO SEIKAN on Sept. 10 for "Sealer, method of its production and all-solid-state secondary battery" (Japanese Inventors)
Published: September 11, 2024 by U.S. Fed News
US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 10 for "Multiple patterning gate scheme for nanosheet rule scaling" (Taiwanese Inventors)
Published: September 11, 2024 by U.S. Fed News

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