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Recent Articles

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Patent Issued for Barrier layer for insulated structures (USPTO 12031771)
Published: July 26, 2024 by Engineering Business Daily
Patent Issued for Barrier layer on a piezoelectric-device pad (USPTO 12035104)
Published: July 25, 2024 by Technology Business Daily
Fortis Solutions Group champions sustainable flexible packaging with advanced barrier properties; enhances product shelf life by optimizing Water Vapor and Oxygen Transmission Rates
Published: July 24, 2024 by Industry Intelligence Inc.
US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 23 for "Semiconductor device structure with barrier layer" (Taiwanese Inventors)
Published: July 24, 2024 by U.S. Fed News
US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 23 for "Interconnect structure having a barrier layer along the sidewall of self-aligned via structures" (Taiwanese Inventors)
Published: July 24, 2024 by U.S. Fed News

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