Paper and Paper-based Packaging Program's Industry Outreach Committee to meet June 25 at AF&PA's offices in Washington, D.C.

Debra Garcia

WASHINGTON , June 12, 2014 (press release) – The Paper and Paper-based Packaging Program’s Industry Outreach Committee will meet on June 25th from 12:00 – 1:00 p.m. (EST) at the offices of the American Forest & Paper Association in Washington, D.C. The meeting is open to the public.

Non-committee members interested in attending are asked to register in advance for security reasons. Send your name, affiliation, email and a contact number by June 23rd to: Chuck Fuqua at Chuck_Fuqua@afandpa.org.

Paper and Paper-based Packaging Board
Industry Outreach Committee Meeting
1101 K St., NW
Suite 700
Washington, D.C. 20005


Draft Agenda

I. Call to Order
II. Welcome/Introductions/Roll Call
III. Antitrust Reminder
IV. Approval of April 15, 2014 Minutes
V. Industry Outreach Plan Updates
VI. Industry Outreach 2015
VII. Other Business
VIII. Time and Date of the Next Meeting

For more information about the program, visit papercheckoff.com.

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The Paper and Paper-based Packaging Board represents companies investing in the paper check-off.

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