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US Patent Issued to QUALCOMM on May 21 for "Prioritizing communications for multiple radio access technologies" (Japanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on May 21 for "Magnetic shielding material with insulator-coated ferromagnetic particles" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on May 21 for "Package structure having at least one die with a plurality of taper-shaped die connectors" (Taiwanese Inventors)

Qualcomm Inc Files Patent Application for Techniques for Shared Radio Frequency Communications Over Multiple Frequency Bands

Qualcomm Inc Files Patent Application for Enabling a Gesture Interface for Voice Assistants Using Radio Frequency (RF) Sensing

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