May 2, 2025 (press release) –
Santa Ana, CA – Duplo USA Corporation is pleased to announce its participation in three major industry events this month. Attendees at each show will experience live demonstrations of Duplo’s latest innovations in print embellishment, packaging, and finishing - designed for today’s on-demand print professionals.
Franchise Services Vendor Show
At the sold-out Sir Speedy/PIP/Signal Graphics Vendor Show in New Orleans, Duplo will engage with franchise owners to highlight how its solutions streamline production and add value. Featured equipment includes the DC-618 Slitter/Cutter/Creaser with in-line folder, DFL-500 Foil/Laminator, and UP-240 Banding Machine.
Odyssey Expo
Duplo will exhibit at Odyssey Expo in Atlanta, a premier event for die cutting and die making. Demonstrations will feature the DSM-1000 B2 Platen Die Cutter, the UD-310 Rotary Die Cutter, and the DPC-600 PKG Digital Die Cutter – showcasing automated and user-friendly capabilities for packaging and specialty applications.
Dscoop Edge
At Dscoop Edge in Long Beach, Calif., Duplo will present a powerful lineup of finishing solutions tailored for HP Indigo users. Focused on high-value embellishments and finishing, the solutions showcase will include the DuSense DDC-8000 B2 Raised Spot UV Coater, DSM-1000 B2 Platen Die Cutter, DC-746 B2 Slitter/Cutter/Creaser, and the CF375 High-Speed Creaser Folder.
“We’re excited to connect with our customers and partners at these events and demonstrate how our latest solutions can elevate their production capabilities,” said Rick Salinas, president of Duplo USA. “Each show offers a unique opportunity to explore how Duplo’s automation and precision technology can unlock new business potential.”
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