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Patent Issued for Injection molding system (USPTO 11491691)

Seiko Epson Submits United States Patent Application for Plasticizing Device, Three-Dimensional Modeling Device and Injection Molding Device

Mold-Tek Packaging to set up facility in Cheyyar, India, for the production, supply of packing materials for Grasim Industries’ Birla Paints division; Mold-Tek also proposes to set up IML container facilities in Cheyyar for food, FMCG clients

US Patent Issued to Seiko Epson on Nov. 8 for "Injection molding system" (Japanese Inventors)

INTERNATIONAL PATENT: SUMITOMO (SHI) DEMAG PLASTICS MACHINERY GMBH FILES APPLICATION FOR "THREADED MECHANISM HAVING A WIPING ELEMENT AND INJECTION MOLDING MACHINE COMPRISING SAME"

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