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Recent Articles

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INTERNATIONAL PATENT: BOSTIK SA FILES APPLICATION FOR "TWO-COMPONENT COMPOSITION BASED ON EPOXY RESIN"

Bostik SA Files Patent Application for Hot Melt Adhesive Composition Which Feels Soft in a Laminate, Methods for Using the Same, and Articles Made Therewith

US Patent Issued to Bostik on April 2 for "Styrene-based materials for hot melt adhesives" (Wisconsin, Massachusetts Inventors)

Bostik to raise prices globally by 5%-7% depending on grade and production location, across hygiene, paper and paperboard specialty adhesives; increases become effective on April 15, 2024

Bostik SA Amplifies Industry Innovation with Diversity-Driven Recruitment Campaign

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