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INTERNATIONAL PATENT: BOSTIK SA FILES APPLICATION FOR "TWO-COMPONENT COMPOSITION BASED ON EPOXY RESIN"
Published:
April 08, 2024
by U.S. Fed News
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Bostik SA Files Patent Application for Hot Melt Adhesive Composition Which Feels Soft in a Laminate, Methods for Using the Same, and Articles Made Therewith
Published:
April 06, 2024
by Indian Patents News
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US Patent Issued to Bostik on April 2 for "Styrene-based materials for hot melt adhesives" (Wisconsin, Massachusetts Inventors)
Published:
April 03, 2024
by U.S. Fed News
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Bostik to raise prices globally by 5%-7% depending on grade and production location, across hygiene, paper and paperboard specialty adhesives; increases become effective on April 15, 2024
Published:
April 02, 2024
by Bostik SA
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Bostik SA Amplifies Industry Innovation with Diversity-Driven Recruitment Campaign
Published:
April 02, 2024
by Industry Intelligence Inc.
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